发明名称 |
Thermosetting Resin Composition for Semiconductor Encapsulation and Encapsulated Semiconductor Device |
摘要 |
<p>A thermosetting resin composition for semiconductor encapsulation contains a both end allyl isocyanurate ring-terminated organopolysiloxane polymer as a sole base polymer and an isocyanurate ring-containing organohydrogenpolysiloxane polymer as a sole curing agent or crosslinker. When a semiconductor element array having semiconductor elements mounted on a substrate with an adhesive is encapsulated with the thermosetting resin composition, warp-free semiconductor devices having improved heat resistance and moisture resistance are obtainable.</p> |
申请公布号 |
EP2615141(A2) |
申请公布日期 |
2013.07.17 |
申请号 |
EP20130151253 |
申请日期 |
2013.01.15 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
UEHARA, TATSUYA;SUMITA, KAZUAKI |
分类号 |
C08L83/08 |
主分类号 |
C08L83/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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