| 摘要 |
PURPOSE: A method for transferring a wafer in an inspection process of light emitting devices is provided to reduce transfer time required in transferring the wafers, by enabling to exchange a test-completed wafer and a test-target wafer at each inspection part while the inspection process for the wafers is performed sequentially through an electrical inspection part and an optical inspection part. CONSTITUTION: A third wafer is withdrawn from a wafer cassette while an optical inspection process is formed for a first wafer and an electrical inspection process is performed for a second wafer(S150). The third wafer and the second wafer are exchanged(S160). The second wafer and the first wafer are exchanged(S170). The first wafer is accommodated in the wafer cassette(S180). [Reference numerals] (AA) Start; (BB) End; (S100) Withdraw a first wafer from a cassette; (S110) Load the first wafer to an electrical inspection unit; (S120) Withdraw a second wafer from the cassette; (S130,S170) Exchange the second wafer and the first wafer; (S140) Load the first wafer to an optical inspection unit; (S150) Withdraw a third wafer from the cassette; (S160) Exchange the third wafer and the second wafer; (S180) Receive the first wafer in the cassette |
