发明名称 Sealed assembled housing containing electronics
摘要 <p>The device has an upper shell (2) provided with safety space located remotely from a predefined horizontal joint plane (J) for accommodating electronics contained in housing. A lower shell accommodates a base of the upper shell that is plunged in resin (6), where a level of the resin is located at the top of the plane without reaching a safety volume (7). A maintain unit i.e. support (11), maintains a lower edge of the upper shell remotely from a bottom of the lower shell for drowning sides and lower fields of the upper shell.</p>
申请公布号 EP2615893(A1) 申请公布日期 2013.07.17
申请号 EP20120350004 申请日期 2012.12.20
申请人 HYDRELIS 发明人 SARTORIUS, THIERRY
分类号 H05K5/06 主分类号 H05K5/06
代理机构 代理人
主权项
地址
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