| 摘要 |
An optical element arrangement and method of use for a microlithography exposure apparatus (figure 1). The optical element unit (106.6 figures 1,2) is split into a plurality of optical sub-elements (111.1 figure 2, 3) having an optical surface section 106.7 and an outer circumferential section 106.8 defining a circumferential plane (x,y). At least one actively supported optical sub-element under the control of a control device connected to a metrology arrangement (110.3, 110.4, 110.5 figure 3) is actively supported by a support structure 108.6. A metrology device is adapted to capture a position and/or an orientation of the actively supported optical sub-element in up to six degrees of freedom (DOF) using a first, second and third metrology units (110.3-5 figure 3), all associated to an actively supported optical sub-element and all connected to the optical sub-element in the area of the circumferential section S1-S5. The circumferential section of the actively supported optical sub-element, the first 110.3 and second 110.4 metrology units in a first direction parallel to the circumferential plane, define a maximum technically feasible first distance D1 between a first and second metrology component (D1 figure 3). Also, the circumferential section of the actively supported optical sub-element and the metrology units, in a second direction perpendicular to the circumferential plane, define a maximum technically feasible second distance between the metrology components D2. |
