发明名称 |
METHOD AND APPARATUS FOR BREAKING SEMICONDUCTOR WAFERS |
摘要 |
<p>An apparatus and method for breaking a semiconductor wafer along scribe lines to separate individual die. A scribe line of the wafer is aligned with a straight, elongated pyramid-shaped edge of a precision bending bar, and a compressive force is applied to the surface of the wafer by a compressive member to bend the wafer over the edge and break the wafer along the scribe line.</p> |
申请公布号 |
EP1941540(B1) |
申请公布日期 |
2013.07.17 |
申请号 |
EP20060788624 |
申请日期 |
2006.07.27 |
申请人 |
DYNATEX INTERNATIONAL (CALIFORNIA CORPORATION) |
发明人 |
BAYLIS, WILLIAM, H.;TYLER, JOHN, E. |
分类号 |
H01L21/44;H01L21/301;H01L21/46 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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