| 摘要 |
A light emitting device package is disclosed. The light emitting device package includes a light emitting device, a body that includes first and second lead frames electrically connected to the light emitting device and has a cavity disposed on the first and second lead frames, and a resin material that fills the cavity and includes a main material having a vinyl group (-CH=CH 2 ) and a sub-material having a plurality of silane groups (Si-H). In the resin material, the vinyl groups and the silane groups are cross-linked to each other by curing. According to an FT-IR signal, an optical density (absorbance) of silane groups (Si-H) not reacted with the vinyl groups (-CH=CH 2 ) may be in the range of 0.0002 to 0.01 (arb. unit). |
