| 摘要 |
PURPOSE: An epoxy composition is provided to have excellent thermal conductivity, to quickly radiate heat generated during operation of a semiconductor to outside and to improve reliability of an electronic device because of excellent flowability. CONSTITUTION: An epoxy composition comprises an epoxy resin, a curing agent, and carbon nanotubes, as an inorganic filler, with average particle diameter of 5-100nm in which an alkyl group is accepted. The epoxy resin is an epoxy resin having two or more glycidyl groups. The comprised amount of the carbon nanotube is 0.1-100.0 parts by weight based on 100.0 parts by weight of the epoxy resin. |
