| 摘要 |
A diffusion bonding machine includes a support structure (60) configured to receive first and second die sets (30,32). A heat transfer device (66) is arranged near the support structure (60) and is configured to transfer heat relative to the die sets (30,32). A mechanism (34) is configured to separate the die sets (30,32) from one another during heat transfer. In a method of diffusion bonding, heat is transferred relative to a space (33) between die sets (30,32). The die sets (30,32) are supported on the support structure (60), and a load is applied to the die sets (30,32) to diffusion bond a component within each of the die sets (30,32). |
