发明名称 |
Leadless array plastic package with various IC packaging configurations |
摘要 |
A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding material, with portions of the electrical contacts and die-attach area protruding from a bottom surface of the molding material.
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申请公布号 |
US8486762(B2) |
申请公布日期 |
2013.07.16 |
申请号 |
US201013254905 |
申请日期 |
2010.03.08 |
申请人 |
MCMILLAN JOHN;PEDRON, JR. SERAFIN P.;POWELL KIRK;FUNG ADONIS;UTAC HONG KONG LIMITED |
发明人 |
MCMILLAN JOHN;PEDRON, JR. SERAFIN P.;POWELL KIRK;FUNG ADONIS |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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