APPARATUS FOR BONDING PRINTED CIRCUIT ON FPD PANEL

摘要

PURPOSE: A bonding equipment for driving circuit board is provided to prevent the property change of panel occurred during the driving circuit board bonding process by adhering the driving circuit board attached anisotropic conductive film with pressure. CONSTITUTION: A circuit board supplying unit (100) consecutively supplies the driving circuit board. A conductive film adhering unit (200) adheres an anisotropic conductive film to the driving circuit board. A bonding unit (300) pressurizes the driving circuit board attached the anisotropic type conductive film in order to adhere the above driving circuit board to the panel. The above bonding unit comprises a preliminary press bonding unit (310) and a main press bonding unit (330). The above supplying unit, the conductive film adhering unit, and the bonding unit form an in-line process.