| 摘要 |
PURPOSE: A module bonding apparatus for producing a flat type display is provided to improve process efficiency by successively performing an anisotropic conductive film attachment process, a module pre-bonding process, and a main bonding process in a substrate loading process without a separate unloading process. CONSTITUTION: A bonding device assembly(2), an elevating device assembly and a horizontal movement device assembly are installed to a turn-table worktable(1). A loading device(5), a plasma treatment device(6), an inspection device(8), and an unloading device(9) are successively arranged in a position facing a substrate mounting part. Therefore, a loading step, a plasma process step, a film bonding step, a pre-bonding step, a main bonding step, a test step, and an unloading step are successively performed. |
