发明名称 Package having light-emitting element and fabrication method thereof
摘要 A package having a light-emitting element includes a substrate having a light-emitting element disposed thereon, an insulating layer formed on the substrate and having an opening for exposing the light-emitting element, a florescent layer formed in the opening of the insulating layer for encapsulating the light-emitting element, and a transparent material formed on the florescent layer and the insulating layer. As such, a specific space can be defined by the insulating layer for exposing the light-emitting element and forming the fluorescent layer, thereby overcoming the problem of non-uniform coating of phosphor powder as encountered in prior techniques.
申请公布号 US8486733(B2) 申请公布日期 2013.07.16
申请号 US201113156003 申请日期 2011.06.08
申请人 LIOU JIA-SHIN;LEE WEN-HAO;CHEN HSIEN-WEN;SILICONWARE PRECISION INDUSTRIES CO., LTD. 发明人 LIOU JIA-SHIN;LEE WEN-HAO;CHEN HSIEN-WEN
分类号 H01L21/00;H01L23/495 主分类号 H01L21/00
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