| 摘要 |
PURPOSE: A film for encapsulation is provided to provide a structure including an element sealed by the film, and to offer excellent water barrier property, handling property, workability, and durability. CONSTITUTION: A film for encapsulation includes a first layer (12) and a second layer (11). A ratio (M1/M2) for the post-cure tensile modulus (M2) of the second layer and the post-cure tensile modulus (M1) of the first layer at 25°C is 1×10^ (-6)-0.5. The post-cure tensile modulus of the first layer at 25°C is 0.001-400 MPa, and the post-cure tensile modulus of the second layer at 25°C is 400-1,000 MPa. The second layer is located on one or both sides of the first layer, and the first layer contains a resin component. The first layer additionally contains 5-250 parts by weight of moisture remover for 100 parts by weight of resin component. The second layer is solid or semi-solid at room temperature. |
