发明名称 Method for manufacturing microcrystalline semiconductor and thin film transistor
摘要 A technique for manufacturing a microcrystalline semiconductor layer with high mass productivity is provided. In a reaction chamber of a plasma CVD apparatus, an upper electrode and a lower electrode are provided in almost parallel to each other. A hollow portion is formed in the upper electrode, and the upper electrode includes a shower plate having a plurality of holes formed on a surface of the upper electrode which faces the lower electrode. A substrate is provided over the lower electrode. A gas containing a deposition gas and hydrogen is supplied to the reaction chamber from the shower plate through the hollow portion of the upper electrode, and a rare gas is supplied to the reaction chamber from a portion different from the upper electrode. Accordingly, high-frequency power is supplied to the upper electrode to generate plasma, so that a microcrystalline semiconductor layer is formed over the substrate.
申请公布号 US8486777(B2) 申请公布日期 2013.07.16
申请号 US201213343734 申请日期 2012.01.05
申请人 ICHIJO MITSUHIRO;KURIKI KAZUTAKA;YOKOI TOMOKAZU;ENDO TOSHIYA;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 ICHIJO MITSUHIRO;KURIKI KAZUTAKA;YOKOI TOMOKAZU;ENDO TOSHIYA
分类号 H01L21/205 主分类号 H01L21/205
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