发明名称 METHOD FOR SEALING ELECTRONIC COMPONENT USING ADHESIVE TAPE WITH MAGNETIC RECEPTIVE LAYER
摘要 PURPOSE: An adhesive tape with a magnet-adhesive layer is provided to reduce process cost, to simplify a semiconductor package process, and to improve workability. CONSTITUTION: An adhesive tape comprises an adhesive layer formed on one side of the substrate film and a magnet-attached layer(2) spread on the other side of the substrate layer. The adhesive layer comprises 100.0 parts by weight of an acrylic copolymer, 0.01-30 parts by weight of hardener, 0.05-30 parts by weight of an energy-curable acrylic oligomer, and 0.0-125 parts by weight of a photoinitiator. The molecular weight of the acrylic copolymer is 400,000-4,000,000. The adhesion of the adhesive layer is 1-350 gf/inch.
申请公布号 KR101285852(B1) 申请公布日期 2013.07.15
申请号 KR20110083839 申请日期 2011.08.23
申请人 发明人
分类号 C09J7/02;C09J9/00;C09J133/04;H01L21/58 主分类号 C09J7/02
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