发明名称 CLEANING METHOD OF CAPILLARY FOR WIRE BONDER
摘要 <p>PURPOSE: A method for cleaning a capillary of a wire bonder is provided to improve an operating rate by automatically withdrawing a wire though the lower side of the capillary after a cleaning process is completed. CONSTITUTION: It is determined whether the number of wire bonding operations exceeds a reference number in a capillary (S1). A wire is cut on the lower side of the capillary (S2). The wire is inputted to the inside of the capillary (S3). The lower side of the capillary is cleaned (S4). The wire is withdrawn (S5). [Reference numerals] (AA) Start; (BB) No; (CC) Yes; (DD) Finish; (S1) Does the number of wire bonding operations exceed a reference number ?; (S2) Cut a wire; (S3) Input a wire; (S4) Cleaning a capillary; (S5) Withdraw a wire</p>
申请公布号 KR20130080344(A) 申请公布日期 2013.07.12
申请号 KR20120001198 申请日期 2012.01.04
申请人 AMKOR TECHNOLOGY KOREA, INC. 发明人 LIM, DEOK IN;LEE, HYUNG JU;KWON, JAE DOO
分类号 H01L21/60 主分类号 H01L21/60
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