| 摘要 |
PURPOSE: A wafer grinding equipment is provided to easily separate the wafer from a grinding pad, thereby preventing the mounting failure of the wafer due to the repetitive deformation. CONSTITUTION: A surface table provides the vacuum pressure. At least one head assembly absorbs the wafer (W) into the lower-side by the vacuum pressure. A grinding pad grinds the wafer which is absorbed in the head assembly. A plate (140) is absorbed to the upper side of the surface table by the vacuum pressure. The plate comprises the connection paths (142,143) of the columnar direction or the diametric direction connecting a hole (141). |
