| 摘要 |
PURPOSE: A device and method for drying a wafer are provided to rapidly dry the wafer by thermally drying the wafer from warm water using a lamp without exposure to the outside. CONSTITUTION: A water tub(110) accommodates hot water. A drying part(120) dries a wafer by being connected to the water tub. The drying part is composed of a lamp(121), a reflection tub(122), and a pollution prevention tube(123). A sensor(131,132) is placed between the drying parts and senses the position of the wafers. A control part controls the operation of the lamps according to a signal of the sensor. |
