SUBSTRATE PROCESSING APPARATUS AND HEATING EQUIPMENT

摘要

PURPOSE: A substrate processing device and a heating device are provided to improve a throughput by rapidly decreasing a temperature in a furnace. CONSTITUTION: A heating unit (30) is composed of a thermal insulator (36) and a heating wire (38) buried in the inner circumference of the thermal insulator. A thermal insulation unit (32) is installed to form a cylindrical space in the heating unit. A top plate (34) is installed on the upper sides of the heating unit and the thermal insulation unit. A cooling gas input unit (40) is installed on the upper side of the thermal insulation unit in an axial direction. A cooling gas discharge unit (52) discharges cooling gases from the cooling gas input unit to the outside.