发明名称 |
MOLDING METHOD FOR A THIN-PROFILE COMPOSITE CAPILLARY STRUCTURE |
摘要 |
A molding method for a thin-profile composite capillary structure includes the steps of preparing a metal grid and metal powder separately; attaching a liquid medium onto the metal grid by means of spraying or brushing or steeping; attaching uniformly the metal powder onto the grid with the liquid medium; and fixing the metal powder onto the surface of the grid by means of sintering, such that a sintered powder layer is formed onto the surface of the grid. The structure includes a metal grid, which is of planar grid pattern made of woven metal wires. A sintered powder layer is sintered onto a lateral surface of the metal grid from the metal powder. The thickness of the sintered powder layer is 0.1 mm-0.7 mm. The total thickness of the thin-profile composite capillary structure is 0.2 mm-0.8 mm, thus presenting flexibility. The thin-profile composite capillary structure is particularly suitable for a heat pipe.
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申请公布号 |
US2013174958(A1) |
申请公布日期 |
2013.07.11 |
申请号 |
US201213346261 |
申请日期 |
2012.01.09 |
申请人 |
HE SIN-WEI;CHANG JHONG - YAN;CHEN YEN-CHEN;FORCECON TECHNOLOGY CO., LTD. |
发明人 |
HE SIN-WEI;CHANG JHONG - YAN;CHEN YEN-CHEN |
分类号 |
B32B38/08;B05D3/02;B05D5/00;B32B37/14 |
主分类号 |
B32B38/08 |
代理机构 |
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代理人 |
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主权项 |
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