| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoelectric hybrid wiring board made thinner than conventional ones, and a manufacturing method thereof.SOLUTION: The photoelectric hybrid wiring board includes an insulating substrate 11b like a thin plate and an electric circuit 11a and an optical waveguide 12 which are formed on a first principal surface of the substrate 11b. The optical waveguide has a light input/output part 13a for inputting/outputting an optical signal in a direction of the substrate 11b, in a region where the electric circuit 11a does not exist on the substrate 11b in plan view, and the substrate 11b includes a first via hole 16 for electric connection to the electric circuit 11a from a second principal surface of the substrate 11b and a second via hole 17a for optical connection to the light input/output part 13a from the second principal surface. |
