发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board in which a thermo-setting solder resist ink is applied to a ground layer, and to provide a manufacturing method of the printed circuit board.SOLUTION: A printed circuit board of this invention includes: a base substrate; a via penetrating through the base substrate; a circuit pattern formed on the base substrate; a ground pattern formed on the base substrate and used for reducing electromagnetic noise; a thermo-setting type heat radiation solder resist formed on the ground pattern and radiating heat; and an insulation layer which is applied onto the base substrate excluding the circuit pattern and the thermo-setting type heat radiation solder resist.
申请公布号 JP2013138181(A) 申请公布日期 2013.07.11
申请号 JP20120249003 申请日期 2012.11.13
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 JUNG JOONG HYUK;YU KWAN SONG;SON SANG HYUK
分类号 H05K1/02;H05K3/28 主分类号 H05K1/02
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