发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board in which a thermo-setting solder resist ink is applied to a ground layer, and to provide a manufacturing method of the printed circuit board.SOLUTION: A printed circuit board of this invention includes: a base substrate; a via penetrating through the base substrate; a circuit pattern formed on the base substrate; a ground pattern formed on the base substrate and used for reducing electromagnetic noise; a thermo-setting type heat radiation solder resist formed on the ground pattern and radiating heat; and an insulation layer which is applied onto the base substrate excluding the circuit pattern and the thermo-setting type heat radiation solder resist. |
申请公布号 |
JP2013138181(A) |
申请公布日期 |
2013.07.11 |
申请号 |
JP20120249003 |
申请日期 |
2012.11.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
JUNG JOONG HYUK;YU KWAN SONG;SON SANG HYUK |
分类号 |
H05K1/02;H05K3/28 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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