| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can form a solder resist layer that has high coloring ability, excellent concealment, and has resolution with a high aspect ratio.SOLUTION: The photosensitive resin composition contains (A-1) a perylene based colorant, (A-2) a phthalocyanine based colorant, and (B) a resin containing carboxylic acid, and is an alkali-developable photo solder resist. |
