发明名称 |
Enhanced Flip Chip Package |
摘要 |
A flip chip package structure is proposed in which a redistribution layer (RDL) is disposed on a surface of both a semiconductor chip and one or more lateral extensions of the semiconductor chip surface. The lateral extensions may be made using, e.g., a reconstituted wafer to implement a fanout region lateral to one or more sides of the semiconductor chip. One or more electrical connectors such as solder bumps or copper cylinders may be applied to the RDL, and an interposer such as a PCB interposer may be connected to the electrical connectors. In this way, a relatively tight semiconductor pad pitch may be accommodated and translated to an appropriate circuit board pitch without necessarily requiring a silicon or glass interposer.
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申请公布号 |
US2013175686(A1) |
申请公布日期 |
2013.07.11 |
申请号 |
US201213346993 |
申请日期 |
2012.01.10 |
申请人 |
MEYER THORSTEN;OFNER GERALD;WAIDHAS BERND;INTEL MOBILE COMMUNICATIONS GMBH |
发明人 |
MEYER THORSTEN;OFNER GERALD;WAIDHAS BERND |
分类号 |
H01L23/498;H01L21/56;H01L21/78 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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