| 摘要 |
An interleaved circuit has first branch conductors branching from a first conductor, second branch conductors branching from a second conductor, a metal base having an opening, an insulating layer formed on the metal base, an electrically insulating first cover resin layer, and an electrically insulating second cover resin layer. The first branch conductors are formed on the insulating layer. The first branch conductors are covered by the first cover resin layer. The second branch conductors are formed on the first cover resin layer. The second branch conductors are individually located between the first branch conductors. The second branch conductors are covered by the second cover resin layer. |
