| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable and low cost technology in thermocompression gang bonding of substrates.SOLUTION: A bonded substrate manufacturing method comprises a step of bonding printed boards with each other, in which electrodes are connected by solder connection using Cu core solder plating balls, and the substrates are bonded with a three-layer binding material composed of adhesive layer/ball holding core layer/adhesive layer by gang thermocompression of the Cu core solder plating balls filled in holes of the three-layer binding material. The electrodes and the substrates are connected by a flux or a wetted solder. |
