Semiconductor package useful in e.g. current sensors and thermal sensors, comprises isolating container e.g. glass having a recess, semiconductor chip disposed in recess, and backplane disposed under membrane portion of isolating container

摘要

Semiconductor package comprises: a first isolating container (1410) having a first recess thus forming an inner membrane portion and an outer rim portion, where the rim portion is at least three times thicker than the membrane portion; a first semiconductor chip disposed in the first recess or above the isolating container; and a first backplane (1405) disposed under the membrane portion of the first isolating container. An independent claim is also included for fabricating the semiconductor package comprising: forming the recess in the substrate thus forming the container having the inner membrane portion and the outer rim portion in the substrate; attaching the semiconductor chip over the membrane portion of the substrate; and attaching the backplane under the inner membrane portion of the substrate.