ELECTRONIC CIRCUIT MODULE COMPONENT AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electronic circuit module component which reduces cracks of a resin having a cavity and contacting with at least a part of an electronic component, and to provide a manufacturing method of the electronic circuit module component.SOLUTION: An electronic circuit module component 1 includes: an electronic component 2; a substrate 3; a first resin 4; and a second resin 9. The electronic component 2 is mounted on the substrate 3. The first resin 4 has a cavity 4H and contacts with at least a part of the electronic component 2. The second resin 9 covers a surface of the first resin 4 and has a void ratio lower than that of the first resin 4. The first resin 4 includes: a stress relaxation layer 42 provided at the second resin 9 side and containing a resin component 9M of the second resin 9; and a porous layer 41 that does not contain the resin component 9M of the second resin 9.