发明名称 |
LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED METHODS OF OPERATION |
摘要 |
Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
|
申请公布号 |
US2013175565(A1) |
申请公布日期 |
2013.07.11 |
申请号 |
US201313774502 |
申请日期 |
2013.02.22 |
申请人 |
MICRON TECHNOLOGY, INC.;MICRON TECHNOLOGY, INC. |
发明人 |
TETZ KEVIN;WATKINS CHARLES M. |
分类号 |
H01L33/64;H01L33/44 |
主分类号 |
H01L33/64 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|