| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology suitable for fitting a substrate, having a hole in which a lead pin is inserted, to a device on which a plurality of lead pins are provided upright.SOLUTION: The specification discloses a jig for assembling a substrate containing a plurality of lead pin holes into a device (semiconductor module 10) where a plurality of lead pins 16 are provided upright, and a method of fitting the substrate. The jig includes at least two taper guide rods 40. The taper guide rod 40 is a tapered rod member provided upright around the semiconductor module 10 so as to be parallel to the extension direction of the lead pin 16. The taper guide rod 40 guides falling of a substrate 20 toward the lead pin 16 by penetrating a guide hole 24 provided to the substrate 20. The taper guide rod 40 is equipped with a pressing-down mechanism which presses down the substrate 20 engaged with the taper guide rod 40 toward the semiconductor module 10. |
