| 摘要 |
An example diffusion bonding machine includes a support structure configured to receive first and second die sets. A heat transfer device is arranged near the support structure and is configured to transfer heat relative to the die sets. A mechanism is configured to separate the die sets from one another during heat transfer. In one example method of diffusion bonding, heat is transferred relative to a space between die sets. The die sets are supported on the support structure, and a load is applied to the die sets to diffusion bond a component within each of the die sets.
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