| 摘要 |
A semiconductor package includes a first semiconductor package, a second semiconductor package, and a package-connecting member. The first semiconductor package includes a first substrate, a chip stacking portion disposed on the first substrate and including a plurality of first semiconductor chips, and a first sealant for surrounding the chip stacking portion on the first substrate. The second semiconductor package includes a second substrate, at least one second semiconductor chip disposed on the second substrate, and a second sealant for surrounding the second semiconductor chip on the second substrate. The package-connecting member electrically connects the first semiconductor package and the second semiconductor package. The plurality of first semiconductor chips include a first chip including through silicon vias (TSVs) and a second chip electrically connected to the first chip via the TSVs, and the chip stacking portion includes an internal sealant for filling a space between the first chip and the second chip and extending to a side of the second chip. |
