发明名称 |
PACKAGE TEST DEVICES HAVING A PRINTED CIRCUIT BOARD |
摘要 |
In a method of designing a printed circuit board, a package capacitance, a package inductance, and a chip capacitance of an actual memory device are calculated. A signal line capacitance and a signal line inductance per unit length of a signal line are calculated based on characteristics of the printed circuit board. A length of the signal line for each pin is determined based on the package capacitance and the signal line capacitance.
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申请公布号 |
US2013176045(A1) |
申请公布日期 |
2013.07.11 |
申请号 |
US201313780891 |
申请日期 |
2013.02.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JEONG JAE-HOON;KO CHANG-WOO;SONG KI-JAE;SEO HUN-KYO |
分类号 |
G01R1/04 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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