发明名称 BONDING METHOD, BONDABILITY IMPROVING AGENT, SURFACE MODIFICATION METHOD, SURFACE MODIFYING AGENT, AND NOVEL COMPOUND
摘要 To provide a technique by which an -OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (alpha) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (alpha) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (alpha) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
申请公布号 US2013177770(A1) 申请公布日期 2013.07.11
申请号 US201113823759 申请日期 2011.09.28
申请人 MORI KUNIO;MATSUNO YUSUKE;MORI KATSUHITO;KUDO TAKAHIRO;SULFUR CHEMICAL INSTITUTE INCORPORATED;KUNIO MORI 发明人 MORI KUNIO;MATSUNO YUSUKE;MORI KATSUHITO;KUDO TAKAHIRO
分类号 C09J5/00 主分类号 C09J5/00
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