| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit connection material and connection structure of circuit member using the same, capable of hardening at a low temperature and in a short time and achieving significantly high connection reliability when applied to an OSP processed substrate.SOLUTION: A circuit connection material 1, used for electrically connecting opposing circuit electrodes 13, 23 with each other, includes an adhesive composition and a conductive particle 5. The conductive particle includes a nuclide composed of metal with Vickers hardness of 300-1000 and an outmost surface layer composed of noble metal covering the surface of the nuclide, and has an average grain diameter of 5-20 μm. |
