| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents adverse effects caused by expansion of a bleed-out component in a simple method without forming a hydrophobic membrane.SOLUTION: A semiconductor device comprises: a metal plate 12 having a recess 40 formed by press work, and rolling flaws; an element 16 fastened to the recess via an adhesive material 14; and a wire 18 connecting the metal plate and the element. A connection point between the metal plate and the wire is arranged on a part on the metal plate except the recess. |
