发明名称 THERMALLY CONDUCTIVE FILLER
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive filler having a composite particle from whose surface a boron nitride fine particle is hardly dropped off even when stress and heat are applied, and capable of maintaining relaxation of anisotropy in thermal conductivity caused due to orientation tendency of the boron nitride fine particle.SOLUTION: This thermally conductive filler includes the composite particle including a boron nitride fine particle 22 and a binder 3. The composite particle has a solid core part 11 containing the fine particle 22 in an unoriented state. The binder 3 comprises an inorganic substance substantially. For instance, the binder 3 is composed of alumina. The composite particle may have a surface layer with the core part 11.
申请公布号 JP2013136658(A) 申请公布日期 2013.07.11
申请号 JP20110287576 申请日期 2011.12.28
申请人 NIPPON SHEET GLASS CO LTD 发明人 IKI KOICHIRO;AZUMA HIDEKI;DOSHITA KAZUHIRO
分类号 C08K3/38;C08L101/00 主分类号 C08K3/38
代理机构 代理人
主权项
地址