COOLING DEVICE AND ELECTRONIC EQUIPMENT USING SAME

摘要

With respect to a cooling device that uses vapor cooling, when mounting such a device in low-profile electronic equipment, not only is sufficient cooling performance unobtainable, but the overall cooling efficiency of the electronic equipment is reduced. Therefore, a cooling device of the present invention is provided with an evaporator, a condenser, a pipe for connecting the evaporator and the condenser, and a rectifier for controlling the flow direction of air passing through the condenser. The evaporator and the condenser are positioned at substantially the same height in the vertical direction. The evaporator has a partition wall section that partitions coolant. The partition wall section has a height that is at least that of a gas-liquid interface but less than the height of the evaporator. The condenser includes a first condenser unit and a second condenser unit having different condenser unit heights which are heights in the vertical direction of a condenser vessel that comprises the condenser. The condenser unit height of the first condenser unit is higher than that of the second condenser unit. The first condenser unit has a steam pipe connection section for connecting with a steam pipe at a location that is vertically higher than the condenser unit height of the second condenser unit. The rectifier is disposed above the second condenser unit.