SEMICONDUCTOR PACKAGING METHOD

摘要

PURPOSE: A semiconductor packaging method is provided to prevent a short circuit by capturing copper ions through a plurality of ionization preventing members. CONSTITUTION: A substrate (110) including a surface (111) and a plurality of junction parts (112) formed on the surface is provided. An ionization preventing colloid (120) is formed on the surface and the junction parts of the substrate. The ionization preventing colloid includes a plurality of conductive particles (121) and a plurality of ionization preventing members (122). A chip including an active surface (131) and a plurality of copper bumps (132) is combined with the substrate. The ionization preventing members cover ring walls (134) of the copper bumps.