LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to supply white light satisfying target color properties by reducing the color distribution of a wavelength conversion unit through a color correction lens with wavelength conversion materials. CONSTITUTION: A light emitting diode package including a wavelength conversion unit is prepared (S21). The color properties of white light provided by the wavelength conversion unit are measured by driving a light emitting diode chip (S23). A color correction lens with wavelength conversion materials for correcting a difference between the measured color properties and target color properties is selected (S25). The selected color correction lens is mounted on the body of the light emitting diode package (S27). [Reference numerals] (S21) Prepare a light emitting diode package including a wavelength conversion unit; (S23) Measure the color properties of a light emitting diode package; (S25) Select a color correction lens to correct a difference between the measured color properties and target color properties; (S27) Mount a color correction lens on a light emitting diode package