| 摘要 |
PURPOSE: An apparatus for polishing the edge of a wafer is provided to improve the quality of the wafer by reducing a polishing difference between a first bevel and a second bevel on the edge of the wafer. CONSTITUTION: A vacuum plate (40) mounts a wafer (4) by an adsorption method. A first nozzle (50) supplies slurry to one side of the wafer. The vacuum plate sprays the slurry on an edge which is adjacent to the other side of the wafer. A chuck shaft (20) rotates the vacuum plate. A pad unit (90) is arranged around the vacuum plate and polishes the edge of the wafer. A bottom plate (30) supports the vacuum plate.
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