发明名称 POLISHING COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a composition which is capable of polishing a metal at a higher speed, has high storage stability, and is capable of polishing an interlayer insulating film with little defects such as scratches, and to provide a polishing method using the same.SOLUTION: The polishing composition of the present invention is used for polishing an object to be polished having a metal or an interlayer insulating film and is characterized by containing silica on which organic acids such as a sulfonic acid and a carboxylic acid are immobilized and an oxidant.
申请公布号 JP2013138053(A) 申请公布日期 2013.07.11
申请号 JP20110287264 申请日期 2011.12.28
申请人 FUJIMI INC 发明人 YOKOTA SHUGO;KACHI YOSHIHIRO;AKATSUKA TOMOHIKO
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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