发明名称 SEALING BODY, LIGHT-EMITTING MODULE, AND MANUFACTURE METHOD OF SEALING BODY
摘要 PROBLEM TO BE SOLVED: To provide a sealing body which is uniformly sealed, a light-emitting module which is uniformly sealed, and a manufacture method of a uniform sealing body.SOLUTION: The inventor has conceived a configuration in which a region having high reflectivity to an energy line and a region having low reflectivity are alternately provided so as to overlap a sealing material which surrounds a body to be sealed by paying attention to a configuration in which a region is provided at a side opposed to an incident side of the energy line across a sealing material.
申请公布号 JP2013138002(A) 申请公布日期 2013.07.11
申请号 JP20120259489 申请日期 2012.11.28
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 NISHITO SUKENORI
分类号 H05B33/04;H01L51/50;H05B33/22;H05B33/24 主分类号 H05B33/04
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