发明名称 |
COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND METHOD FOR MANUFACTURING COMPONENT BUILT-IN MODULE |
摘要 |
A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other. |
申请公布号 |
US2013176689(A1) |
申请公布日期 |
2013.07.11 |
申请号 |
US201113824479 |
申请日期 |
2011.07.08 |
申请人 |
NISHIMURA NOZOMU;MIKAMI NOBUHIRO;NEC CORPORATION |
发明人 |
NISHIMURA NOZOMU;MIKAMI NOBUHIRO |
分类号 |
H05K7/02;H05K3/30 |
主分类号 |
H05K7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|