| 摘要 |
PROBLEM TO BE SOLVED: To obtain an air conditioning device capable of properly performing cooling according to heat generation states of respective function circuits and an air volume of a fan at the cooling of a semiconductor module embedding a plurality of function circuits in one package.SOLUTION: On a heat radiation plate 7, a wide pitch part 7b is formed at a position corresponding to an arrangement region of a first function circuit such that intervals of heat radiation fans are a predetermined value. Further, a narrow pitch part 7a is formed at a position corresponding to an arrangement region of a second function circuit such that the intervals of the heat radiation fans are rendered narrower compared to the wide pitch part 7b. A control device 2 increases an air volume of a fan 3 according to the magnitude of a set operation capacity. |
