| 摘要 |
PURPOSE: A substrate inspecting device, a substrate inspecting method using the same, and a substrate bonding method using the substrate inspecting device are provided to efficiently inspect a bonded substrate and to improve a quality of the bonded substrate by readjusting the distribution of a bonding force. CONSTITUTION: A substrate inspecting device includes a body, a stage (131), a lighting unit (132), a camera unit, and a bonded state calculation unit (134c). The stage is installed on the body, and a bonded substrate (S3) is laminated on the top surface of the stage. A process substrate and a transporting substrate are bonded so that the bonded substrate is formed. The lighting unit is installed on the stage or the body for irradiating inspection lights (L) to a side of the bonded substrate. The camera unit is installed on the body or the stage for photographing the bonded substrate. The bonded state calculation unit calculates the bonded state information in respect to bonded states of the process substrate and transporting substrate based on images of the bonded substrate provided from the camera unit. [Reference numerals] (134a) Camera unit control unit; (134b) Image processing unit; (134c) Bonded state calculation unit; (134d) Bonding force regulation information calculation unit; (134e) Central control unit
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