发明名称 HEAT-PROCESSABLE THERMALLY CONDUCTIVE POLYMER COMPOSITION
摘要 <p>The present invention relates to a heat-processable thermally conductive polymer composition comprising (a) 30 to 95% by weight of a thermoplastic polymer (b) 5 to 40% by weight of a graphite powder; and (c) 0 to 65% by weight of optional further component(s), wherein the particles of the graphite powder are in the form of platelets having a thickness of less than 500 nm, and a process for the preparation heat-processable thermally conductive polymer composition.</p>
申请公布号 EP2195374(B1) 申请公布日期 2013.07.10
申请号 EP20080804922 申请日期 2008.09.30
申请人 DSM IP ASSETS B.V. 发明人 POT, ABEL, FRANS;DIJK, VAN, HANS, KLAAS;JANSSEN, ROBERT, HENDRIK, CATHARINA
分类号 C08K3/04;C08K7/00 主分类号 C08K3/04
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