| 摘要 |
An image sensor assembly (100) includes an image sensor die (110) attached adjacent to a cavity (104) and a lower surface (109) in a preformed package having vertical surfaces (106) extending from the lower surface to an upper surface (108) of the package. The image sensor die may include a charge-coupled device or an active pixel sensor imager that provides the light receiving surface (112) for capturing the image. A cover (120) is placed over the upper surface of the package. The cover may be a glass cover or an infrared cut filter. A light absorbing layer (124) is applied to the cover in registry with the image sensor die such that the light absorbing layer prevents light from falling on the vertical surfaces of the preformed package without preventing the passage of light that falls on the light receiving surface of the image sensor die. |
