SEMICONDUCTOR PACKAGE HAVING A REDISTRIBUTION STRUCTURE

摘要

PURPOSE: A semiconductor package having a redistribution structure is provided to improve operation stability by using a symmetric signal line structure. CONSTITUTION: A first lead (310) is adjacent to a first surface. A second lead (315) is adjacent to a second surface. A stack semiconductor chip (400A) is arranged between the first lead and the second lead. The stack semiconductor chip includes semiconductor chips. A redistribution structure is arranged on the stack semiconductor chip.