发明名称 |
METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE |
摘要 |
A method for manufacturing a base material having a gold-plated metal fine pattern is disclosed, comprising the steps of preparing a base material having a supporting surface made of a resin; forming a primer resin layer having surface roughness of 0.5 μm or less on the supporting surface, and forming a metal fine pattern thereon by an SAP process to obtain a base material having a metal fine pattern; and applying a gold-plating treatment to at least one part of a surface of the metal fine pattern; wherein the base material having a metal fine pattern is subjected to a palladium removal treatment in an optional stage before carrying out the gold-plating treatment. |
申请公布号 |
KR20130079404(A) |
申请公布日期 |
2013.07.10 |
申请号 |
KR20127030100 |
申请日期 |
2011.05.26 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
TACHIBANA KENYA;ITO TEPPEI;MITSUI YASUAKI |
分类号 |
H05K3/18;H01L23/12;H05K3/22 |
主分类号 |
H05K3/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|